As the line width of the semiconductor device is minimized,
the material having a high thickness as an etch mask material for forming a fine pattern has a high aspect ratio,
resulting in problems such as pattern collapse.
For this reason, a silicon hardmask material is needed that can sufficiently serve
as a mask for the substrate even at low coating thickness,
HUNETPLUS' Silicon Hardmask material is a Si-O-based material
and is a process material with high etch selectivity and low reflectivity.