As the line width of the semiconductor device is minimized,

the material having a high thickness as an etch mask material for forming a fine pattern has a high aspect ratio,

resulting in problems such as pattern collapse.

For this reason, a silicon hardmask material is needed that can sufficiently serve

as a mask for the substrate even at low coating thickness,

HUNETPLUS' Silicon Hardmask material is a Si-O-based material

and is a process material with high etch selectivity and low reflectivity.

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